Engineering services


IcoFlex is an expert in the micrometric mechanical machining of glass, numerous hard and brittle materials, composites and multilayers. Drawing on this unique know-how, it develops processes for its customers in the areas of assembly, electronic chip packaging and decoration, and provides a cleanroom micro-fabrication service.


Development of micro-fabrication processes

IcoFlex has a grey room equipped for photolithography and chemical etching processes. Depending on requirements, the company completes its range of microtechnology services by calling on partners or using the EPFL's Centre for Micro and Nanotechnology (CMI-EPFL), where trained IcoFlex engineers have access to more than 1,000 m2 of fully-equipped cleanroom space for process development and small series production.  


"Carbon-fiber heat-pipe for spacecraft thermal control" EPFL-LTCM - Icoflex

Tell us about your microtechnology needs and we can help you or point you in the right direction..


1. Micro-machining of grooves inside a Carbon Fibre Reinforced Polymer tube (CFRP)

2. Glass micro-fluidic chip

3. Cell with 24 gold contacts for electrically contacting the 2 sides of a glass part (IcoPackTM interposer)

Sensor packagings

Over the last few years, IcoFlex has developed various solutions for encapsulating sensors. Customers can benefit from complete solutions or individual components.

One example is the IcoPack™ (Glass Wafer Level Packaging) solution: a platform for electrically connecting the two sides of a glass plate by holes filled with an electrical conductor (Through Glass Vias, TGV)). It enables the hermetic encapsulation of a chip or microsystem such as a MEMS (Micro-Electro-Mechanical-System) or electronic components.



Schematic illustration of electronic system packages



Expertise in cleanroom microfabrication processes, electronics and chemistry combined.


1. Ecapsulation cavities etched into the glass by microsandblasting, depth: 1.2 mm

2. TGV with double tapered pins for greater mechanical stability

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Our skills:

  • Mechanical design
  • Electrical design
  • Energy harvesting
  • Manufacturing solutions
  • Micro-machining
  • Sensor integration and design
  • Camera-based measurements
  • Artificial Intelligence
  • IP search
  • Patent drafting