Micro-machining by sandblasting

Grooves, cavities, holes, cut-outs

Micro-machining by sandblasting is a technology in which a jet of micro-particles accelerated by high-pressure air is used to mechanically etch the material. To micro-structure the hard, brittle material, the areas to be spared are masked with an abrasion-resistant material so that the free areas are etched to create cavities or through structures. The sandblast is distributed evenly over the surface of the part to create a homogeneous, anisotropic etch.

With some twenty years' experience, IcoFlex has perfect mastery of this abrasion micromachining technology in a wide range of materials. It is one of the only suppliers of this technology in Europe.

Highlights of our machining technology

• Cutting complex shapes.
• Anisotropic engraving (machining angle of approximately 15° in the glass).
• Protected surfaces retain their original qualities. Direct glass-to-glass sealing and encapsulation capabilities are preserved.
• No induced thermal or mechanical stress.
• No burrs.
• Low cost.

Machining characteristics

• Machining depth: thickness = 2 mm.
• Structure size = 100 µm.
• Structure accuracy linked to the machining mask: ± 5 µm.
• Engraving angle: 10 to 25° depending on the material.
• Roughness: Ra approx. 1.1 µm in glass but varies according to material.
• Aspect ratio for glass: max. 1:1 for structures < 200 µm and 2:1 for structures = 200 µm.
• Engraving accuracy: 20 µm or 10% of depth if depth > to 200 µm.

Machined materials

• Hard ceramic: Aluminium nitride.
• Brittle ceramics: Piezoceramics (PZT), porous ceramics, carbon
• Glass: Borofloat 33, Quartz, special glass (enamel, infrasil, etc.).
• Semiconductors: Silicon.
• Natural materials: mother-of-pearl, semi-precious stones (onyx, lapis lazuli, etc.).
• Metals: Precious metals in thin layers and sintered oxides (ferrite).
• Plastics: PMMA, Epoxy, PEEK.

Other mastered technologies

• Glass/glass or glass/silicon seal (with or without intermediate layer).
• Metal deposition by evaporation or electroplating.
• Formulation of polymer materials (photosensitive polymers, adhesives, dyes, etc.).